multilayer ceramic chip capacitors 1 of 3 creation date : november 16, 2017 (gmt) CGA4J1X7R1V225M125AE tdk item description cga4j1x7r1v225mt***s applications automotive grade feature soft soft termination aec-q200 aec-q200 series cga4(2012) [eia 0805] status production size length(l) 2.00mm +0.45,-0.20mm width(w) 1.25mm +0.25,-0.20mm thickness(t) 1.25mm +0.25,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 2.2f 20% rated voltage 35vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 227m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 16, 2017 (gmt) CGA4J1X7R1V225M125AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance CGA4J1X7R1V225M125AE esr CGA4J1X7R1V225M125AE capacitance CGA4J1X7R1V225M125AE dc bias characteristic CGA4J1X7R1V225M125AE temperature characteristic CGA4J1X7R1V225M125AE(no bias) CGA4J1X7R1V225M125AE(dc bias = 17.5v) ripple temperature rising CGA4J1X7R1V225M125AE(100khz) CGA4J1X7R1V225M125AE(500khz) CGA4J1X7R1V225M125AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 16, 2017 (gmt) CGA4J1X7R1V225M125AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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